Analysis of thermal and electromagnetic shielding properties based on copper/diamond composites
The Korean Physical Society, DCC DAEJEON, Korea (2023)
Tae-Han Kim, In-Sung Lee, Yong Bin Bang Young Pyo Jeon, Jun Yong Song, Young Joon Yoo, and Sang Yoon Park
Abstract
In this study, we investigated the thermal and electromagnetic interference shielding properties of copper/diamond composites by varying the size and volume fraction of the diamond particles and the thickness of the interlayer material using 3D finite-difference time-domain (FDTD) simulations.
Copper coated diamond particles have shown great promise for improving the thermal and mechanical properties in semiconductor packaging materials. In addition to these advantages, Cu-coated diamond particles may also have the potential to provide the function of electromagnetic shielding effectiveness due to their electrical conductive properties. These versatile functions of copper/diamond composites can be beneficial to reduce the cost of packaging process and increase the performance of recent advanced semiconductor chips